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Fault and self-repair for high reliability in die-to-die ... | ResearchHub
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Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC
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Authors
Ren-Hao Song
4 more
Ren-Hao Song
•
Junqin Zhang
2 more
•
Yintang Yang
Published
June 3, 2024
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Journal
Microelectronics Reliability
Topics
Computer Science
Materials Science
Physics
Engineering
Quantum Mechanics
Show all topics
DOI
10.1016/j.microrel.2024.115429
