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Understanding interfacial compounds induced by Ag diffusi... | ResearchHub
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Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film
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Authors
Zeyu Liu
4 more
Zeyu Liu
•
Limei Shen
2 more
•
Zhichun Liu
Published
June 6, 2024
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Journal
Journal of Alloys and Compounds
Topics
Physics
Materials Science
Chemistry
Engineering
Physical Chemistry
Show all topics
DOI
10.1016/j.jallcom.2024.175101