Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system

Supporters

Support the authors with ResearchCoin

Tip RSC

Journal

Journal of Industrial and Engineering Chemistry

Topics

Physics

Materials Science

Engineering

Materials Chemistry

Electrical And Electronic Engineering

Show all topics

DOI

10.1016/j.jiec.2024.07.033