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Towards void-free copper filling of low-aspect-ratio heat... | ResearchHub
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Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system
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Authors
Zhe Wang
4 more
Zhe Wang
•
Pengfei Su
2 more
•
Qing Wang
Published
July 1, 2024
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Journal
Journal of Industrial and Engineering Chemistry
Topics
Physics
Materials Science
Engineering
Materials Chemistry
Electrical And Electronic Engineering
Show all topics
DOI
10.1016/j.jiec.2024.07.033
