Abstract

Strain sensors which are embeded in AMOLED are introduced and studied in this paper. High accuray strain sensing are achieved, resolution of the sensors are about 0.05%. By combing the strain sensors in the panel, mechanical behaviors can be monitored and studied in real time. The snesors are used to conduct the foldable AMOLED mechanical and reliability study. Dynamic and static strains and related mechanism are introduced and discussed. Finite element simulation models considering the mechanical properties of materials including hyperelasticity, viscoelasticity and creep are established. Finally, the strain sensors and finite element anlysis are combined to study the mechanical response of AMOLED under dynamic folding, static folding, and different temperature and humidity environments.