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Exploring Bonding Mechanism of SiCN for Hybrid Bonding | ResearchHub
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Exploring Bonding Mechanism of SiCN for Hybrid Bonding
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Authors
Sodai Ebiko
5 more
Sodai Ebiko
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Serena Iacovo
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•
Fumihiro Inoue
Published
May 28, 2024
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Topics
Physics
Materials Science
Quantum Mechanics
Ceramics And Composites
Mechanical Engineering
Show all topics
DOI
10.1109/ectc51529.2024.00331
