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Embedded Liquid Cooling of High-Power Microelectronics Us... | ResearchHub
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Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal
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Authors
Huicheng Feng
7 more
Huicheng Feng
•
Bin He
5 more
•
Ming Jong
Published
May 28, 2024
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Topics
Physics
Materials Science
Engineering
Quantum Mechanics
Mechanical Engineering
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DOI
10.1109/ectc51529.2024.00256
