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Multi-tier die stacking through collective die-to-wafer h... | ResearchHub
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Multi-tier die stacking through collective die-to-wafer hybrid bonding
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Authors
Koen Kennes
9 more
Koen Kennes
•
Lin Ye
7 more
•
Eric Beyne
Published
May 28, 2024
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Topics
Physics
Materials Science
Electrical And Electronic Engineering
Biomedical Engineering
Nuclear Magnetic Resonance
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DOI
10.1109/ectc51529.2024.00106
