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A predictive methodology for BGA solder joint formation a... | ResearchHub
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A predictive methodology for BGA solder joint formation and assembly defects
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Authors
M Bond
5 more
M Bond
•
Mudasir Ahmad
3 more
•
Yue Tang
Published
May 28, 2024
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Topics
Computer Science
Materials Science
Engineering
Electrical And Electronic Engineering
Industrial And Manufacturing Engineering
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DOI
10.1109/ectc51529.2024.00254
