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Improved thermal conductivity of high‐density polyethylen... | ResearchHub
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Improved thermal conductivity of high‐density polyethylene by incorporating hybrid fillers of copper powders and silicon carbide whiskers
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Authors
Ganqiu Yang
5 more
Ganqiu Yang
•
Yao Li
3 more
•
Huawei Zou
Published
August 8, 2024
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Journal
Journal of Applied Polymer Science
Topics
Engineering
Materials Science
Materials Chemistry
Biomedical Engineering
Whiskers
Show all topics
DOI
10.1002/app.56099
