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Water stress corrosion at wafer bonding interface during ... | ResearchHub
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Water stress corrosion at wafer bonding interface during bond strength evaluation
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Authors
Tomoya Iwata
5 more
Tomoya Iwata
•
Junya Fuse
3 more
•
Fumihiro Inoue
Published
December 1, 2024
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Journal
Materials Science in Semiconductor Processing
Topics
Materials Science
Finance
Electrical And Electronic Engineering
Biomedical Engineering
Stress (Linguistics)
Show all topics
DOI
10.1016/j.mssp.2024.108820
License
CC-BY
Supporters
Support the authors with ResearchCoin
Tip RSC
Journal
Materials Science in Semiconductor Processing
Topics
Materials Science
Finance
Electrical And Electronic Engineering
Biomedical Engineering
Stress (Linguistics)
Show all topics
DOI
10.1016/j.mssp.2024.108820
License
CC-BY
