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Water stress corrosion at wafer bonding interface during bond strength evaluation
Philosophy
Finance
Biomedical Engineering
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Authors
Tomoya Iwata
,
Junya Fuse
Yoshihiro Yoshihara
,
Yusuke Kondo
,
Mitsuru Sano
+3 authors
,
Fumihiro Inoue
Journal
Materials Science in Semiconductor Processing
Published
Dec 1, 2024
DOI
10.1016/j.mssp.2024.108820
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