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Toward ultra-high-rate copper pattern electroplating with... | ResearchHub
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Toward ultra-high-rate copper pattern electroplating with simultaneously improved coating properties via simulations and experiments
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Authors
Qing Wang
4 more
Qing Wang
•
Pengfei Su
2 more
•
Xiaobing Luo
Published
September 17, 2024
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Journal
Journal of Manufacturing Processes
Topics
Materials Science
Electronic, Optical And Magnetic Materials
Electrical And Electronic Engineering
Coating
Composite Material
Show all topics
DOI
10.1016/j.jmapro.2024.09.034