Abstract

We proposed a unique wire-production process by rolling up and drawing chemical vapor deposition copper/graphene (Cu/Gr) foils, and a good strength-conductivity trade-off was achieved originating from the dispersed Gr in Cu matrix and the high-quality heterointerfaces. The 1.14 mm cold-drawn composite wires exhibited a tensile strength of 455 ± 5 MPa and a conductivity of 98.18 ± 0.16 % of the International Annealed Copper Standard (IACS), and the tensile strength was 250 ± 2 MPa with a satisfied electrical conductivity of 101.68 ± 0.52 % IACS upon annealing. The microstructure involution during the preparing process was revealed, and the reinforcement mechanisms in the yield strength and conductivity due to the introduced Gr were clarified. The results indicated that the Gr plays a role in pinning dislocations and preventing grain boundary movement during deformation and the subsequent annealing, thereby enhancing the strength of the Cu matrix. Meanwhile, the Cu-Gr coupling interfaces exhibited an electronic doping effect, enhancing the conductive properties. Our work presented a feasible method for preparing Cu/Gr composite wire with comprehensive electrical conductivity and strength optimization.