Abstract

In this presentation we share how the development of step-and-repeat DTL technology is addressing the growing need for periodic patterning in large-area device fabrication for display, AR/VR, and other photonic applications with low-cost, high-throughput (+40wph), high-resolution (UV, DUV) capabilities. Like projection lithography, non-contact, optical patterning is very repeatable and with a particle controlled mini-environment, robust to defectivity. Unlike projection, the DTL image is not limited to a small depth of focus (DOF). High resolution patterning is reliable over non-planar substrates and topography (300-400um), which is especially useful in applications where substrates are thick or so large that flatness is difficult to control. Other production–centric features include fully automated wafer and mask handling and high wafer throughput (+40wph). This technology shares the same material and process solutions that have been successfully used for semiconductor lithography for decades.