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Improvement of Silicon and Epoxy Phase Interface by Const... | ResearchHub
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Improvement of Silicon and Epoxy Phase Interface by Constructing Rigid Interpenetrating Networks Based on Bismaleimide to Enhance Ablative, Mechanical and Thermal Properties
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Authors
Youquan Ling
8 more
Youquan Ling
•
Baowei Qiu
6 more
•
Huawei Zou
Published
July 4, 2024
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Journal
Composites Part B Engineering
Topics
Physics
Materials Science
Chemistry
Medicine
Internal Medicine
Show all topics
DOI
10.1016/j.compositesb.2024.111675
