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Design and Fabrication of a MEMS Temperature and Pressure... | ResearchHub
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Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor With Back-Inlet Package Structure
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Authors
Xiangguang Han
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Xiangguang Han
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•
Xiaowei Hou
Published
January 1, 2024
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Journal
IEEE Sensors Journal
Topics
Physics
Materials Science
Engineering
Medicine
Quantum Mechanics
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DOI
10.1109/jsen.2024.3424477
