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Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor With Back-Inlet Package Structure
Mechanical Engineering
Electrical And Electronic Engineering
Physics
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Authors
Xiangguang Han
,
Libo Zhao
Shu Fan
,
Yong Xia
,
Zhengping Qiao
,
Wei Li
,
Yi Gao
,
Ping Yang
,
Shuai Chen
,
Zeyu Cui
,
Cheng Zhang
,
Zhikang Li
+10 authors
,
Xiaowei Hou
Journal
IEEE Sensors Journal
Published
Jan 1, 2024
DOI
10.1109/jsen.2024.3424477
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