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Research on the Electro-Thermal–Mechanical Properties of ... | ResearchHub
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Research on the Electro-Thermal–Mechanical Properties of IGBT Modules Under Different Bond Wire Failure Modes
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Authors
Hanwen Ren
8 more
Hanwen Ren
•
Siyang Zhao
6 more
•
Yiming Liu
Published
May 28, 2024
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Journal
IEEE Transactions on Electron Devices
Topics
Physics
Materials Science
Engineering
Finance
Electrical And Electronic Engineering
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DOI
10.1109/ted.2024.3404417
