Abstract

A model is derived using the charge-pumping technique for the evaluation of the interface characteristics, in combination with the behavior of the drain and the substrate currents after degradation. For n-channel transistors the degradation is mainly caused by the generation of interface traps. Only in the region of hole injection (V/sub g/ approximately=V/sub t/) is the degradation dominated by the trapped holes, which mask the effect of the generated interface traps. The degradation of p-channel transistors, although completely different at first sight, occurs by the same mechanisms. For this case, the degradation is caused by trapped negative charge, which masks the influence of the interface traps. The latter are nevertheless generated in comparable amounts as in n-channel transistors. Based on these insights, improved procedures for accelerated-lifetime experiments are proposed for both channel types. Finally, the peculiar degradation behavior of n-channel transistors under alternating injection conditions is discussed and fully explained based on the static stress degradation model.>