Abstract

Advanced MaterialsVolume 21, Issue 36 p. 3703-3707 Communication Ultrathin Silicon Circuits With Strain-Isolation Layers and Mesh Layouts for High-Performance Electronics on Fabric, Vinyl, Leather, and Paper Dae-Hyeong Kim, Dae-Hyeong Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorYun-Soung Kim, Yun-Soung Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorJian Wu, Jian Wu Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)Search for more papers by this authorZhuangjian Liu, Zhuangjian Liu Institute of High Performance Computing 1 Fusionopolis Way, #16-16 Connexis 138632 Singapore (Singapore)Search for more papers by this authorJizhou Song, Jizhou Song Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA)Search for more papers by this authorHoon-Sik Kim, Hoon-Sik Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorYonggang Y. Huang, Yonggang Y. Huang Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)Search for more papers by this authorKeh-Chih Hwang, Keh-Chih Hwang FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China)Search for more papers by this authorJohn A. Rogers, Corresponding Author John A. Rogers jrogers@uiuc.edu Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA).Search for more papers by this author Dae-Hyeong Kim, Dae-Hyeong Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorYun-Soung Kim, Yun-Soung Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorJian Wu, Jian Wu Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)Search for more papers by this authorZhuangjian Liu, Zhuangjian Liu Institute of High Performance Computing 1 Fusionopolis Way, #16-16 Connexis 138632 Singapore (Singapore)Search for more papers by this authorJizhou Song, Jizhou Song Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA)Search for more papers by this authorHoon-Sik Kim, Hoon-Sik Kim Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Search for more papers by this authorYonggang Y. Huang, Yonggang Y. Huang Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA) Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)Search for more papers by this authorKeh-Chih Hwang, Keh-Chih Hwang FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China)Search for more papers by this authorJohn A. Rogers, Corresponding Author John A. Rogers jrogers@uiuc.edu Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA) Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA).Search for more papers by this author First published: 22 September 2009 https://doi.org/10.1002/adma.200900405Citations: 333AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat Abstract We present various stretchable high-performance CMOS circuit demonstrations on unconventional substrates, such as fabric, vinyl, leather, and paper. Electronics on such substrates, especially paper, open up new and important application possibilities for electronics. Theoretical analysis reveals the underlying mechanics of these systems; electrical tests under mechanical cycling demonstrate the robustness of the designs. Citing Literature Volume21, Issue36September 25, 2009Pages 3703-3707 RelatedInformation