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Failure Mechanisms Investigation of Through Glass via (TG... | ResearchHub
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Failure Mechanisms Investigation of Through Glass via (TGV) Under Thermal Annealing and Shock
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Authors
Haozhong Wang
7 more
Haozhong Wang
•
Chunchao Lai
5 more
•
Xiaofeng Yang
Published
August 7, 2024
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Topics
Computer Science
Materials Science
Physics
Engineering
Mechanical Engineering
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DOI
10.1109/icept63120.2024.10668558
