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Application and Optimization of Laser-Assisted Bonding (L... | ResearchHub
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Application and Optimization of Laser-Assisted Bonding (LAB) in Multi-Chip Integration
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Authors
Cheng-Yong Zhang
5 more
Cheng-Yong Zhang
•
Ziyu Liu
3 more
•
Cheng Zhang
Published
August 7, 2024
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Topics
Computer Science
Materials Science
Physics
Optics
Electrical And Electronic Engineering
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DOI
10.1109/icept63120.2024.10668613
