Paper
Paper
Search...
Search ResearchHub...
Ctrl+K
New
Home
Browse
Earn
Fund
RH Journal
Notebook
Lists
Leaderboard
RSC
USD
Changelog
Terms
Privacy
Issues
Docs
Support
Foundation
About
TDR Technology Detects Solder Joint Cracking of BGA Packa... | ResearchHub
Paper
Paper
Search...
Search ResearchHub...
Ctrl+K
New
Home
Browse
Earn
Fund
RH Journal
Notebook
Lists
Leaderboard
RSC
USD
Changelog
Terms
Privacy
Issues
Docs
Support
Foundation
About
TDR Technology Detects Solder Joint Cracking of BGA Packaged Device
0
Authors
Xiaowen Zhang
2 more
Xiaowen Zhang
•
Xiao‐Ling Lin
•
Wei Long
Published
August 7, 2024
Paper
Conversation
0
Reviews
0
Bounties
0
Abstract
Supporters
Support the authors with ResearchCoin
Tip RSC
Topics
Engineering
Materials Science
Electrical And Electronic Engineering
Hardware And Architecture
Composite Material
Show all topics
DOI
10.1109/icept63120.2024.10668442
