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Thermal behavior of silver nanoparticles for low-temperat... | ResearchHub
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Thermal behavior of silver nanoparticles for low-temperature interconnect applications
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Authors
Kyoung‐Sik Moon
6 more
Kyoung‐Sik Moon
•
Hai Dong
4 more
•
Ching‐Ping Wong
Published
February 1, 2005
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Journal
Journal of Electronic Materials
Topics
Physics
Materials Science
Engineering
Chemical Engineering
Materials Chemistry
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DOI
10.1007/s11664-005-0229-8
