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Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Mechanical Engineering
Materials Chemistry
Atmospheric Science
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Authors
Kyoung‐Sik Moon
,
Hai Dong
Radenka Marić
,
S. Pothukuchi
,
Andrew Hunt
,
Yi Li
,
C.P. Wong
+5 authors
,
Ching‐Ping Wong
Journal
Journal of Electronic Materials
Published
Feb 1, 2005
DOI
10.1007/s11664-005-0229-8
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