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Circuit and microarchitecture evaluation of 3D stacking m... | ResearchHub
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Circuit and microarchitecture evaluation of 3D stacking magnetic RAM (MRAM) as a universal memory replacement
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Authors
Xiangyu Dong
5 more
Xiangyu Dong
•
Xiaoxia Wu
3 more
•
Yiran Chen
Published
June 8, 2008
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Topics
Computer Science
Physics
Engineering
Computer Networks And Communications
Atomic And Molecular Physics, And Optics
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DOI
10.1145/1391469.1391610
