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Low-Temperature Sintering with Nano-Silver Paste in Die-A... | ResearchHub
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Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
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Authors
Tao Wang
3 more
Tao Wang
•
Xu Chen
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•
Guangyin Lei
Published
September 10, 2007
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Journal
Journal of Electronic Materials
Topics
Computer Science
Materials Science
Engineering
Chemical Engineering
Electrical And Electronic Engineering
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DOI
10.1007/s11664-007-0230-5
