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Joining of Silver Nanomaterials at Low Temperatures: Proc... | ResearchHub
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Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
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Authors
Peng Peng
5 more
Peng Peng
•
Lei Liu
3 more
•
Y. Zhou
Published
May 25, 2015
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Journal
ACS Applied Materials & Interfaces
Topics
Physics
Materials Science
Optics
Electrical And Electronic Engineering
Atmospheric Science
Show all topics
DOI
10.1021/acsami.5b02134
