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Wetting dynamics and heat transfer of droplet evaporation... | ResearchHub
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Wetting dynamics and heat transfer of droplet evaporation around boiling point: Facile manipulation by surface roughness
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Authors
Yukai Lin
3 more
Yukai Lin
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Xiaomin Wu
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•
Fuqiang Chu
Published
November 1, 2024
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Journal
Applied Thermal Engineering
Topics
Mathematics
Materials Science
Physics
Electrical And Electronic Engineering
Computational Mechanics
Show all topics
DOI
10.1016/j.applthermaleng.2024.124851
