Paper
Abstract In this paper, the effects of board restraint conditions and package location on the fatigue life of quad flat packaging (QFP) interconnect structures under random vibration loading for automotive applications are evaluated using the finite element method. Four different restraint conditions of the board model were used to reproduce the natural frequencies of the board, and six different positions of the package were analyzed and evaluated. The results show that the fatigue life depends on the relationship between the first-order natural frequency and the patterns of power spectral density (PSD) of the input. In addition, it was found that the maximum principal strain of printed circuit board (PCB) directly under the center of package had a significant effect on the maximum damage location and its damage value in the lead area. The relationship between the package mounting position and board restraint conditions and the degree of damage was found to be regular.