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Reliable Simulation Analysis of Interface and SiON Degrad... | ResearchHub
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Reliable Simulation Analysis of Interface and SiON Degradation Effects on Water Vapor Barrier in Laminated Thin‐Film Encapsulation
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Authors
X.-J. Liu
12 more
X.-J. Liu
•
Ruijiang Hong
10 more
•
Zhinong Yu
Published
November 19, 2024
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Journal
physica status solidi (a)
Topics
Computer Science
Materials Science
Chemistry
Engineering
Chemical Engineering
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DOI
10.1002/pssa.202400577
