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An Efficient SPICE-compatible Model for Fast Co-simulatio... | ResearchHub
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An Efficient SPICE-compatible Model for Fast Co-simulation of Signal and Power Integrity on Multilayer PCB with Arbitrary Shape
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Authors
Hyun‐Woo Kim
7 more
Hyun‐Woo Kim
•
Dongryul Park
5 more
•
Seungyoung Ahn
Published
October 6, 2024
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Topics
Computer Science
Quantum Mechanics
Physics
Engineering
Electrical And Electronic Engineering
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DOI
10.1109/epeps61853.2024.10754366
