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Fast fabrication of high thermal conductivity copper-diam... | ResearchHub
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Fast fabrication of high thermal conductivity copper-diamond composites via DC electrodeposition with simple electrolyte formula
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Authors
Pengfei Su
9 more
Pengfei Su
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Qing Wang
7 more
•
Mingxiang Chen
Published
November 27, 2024
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Journal
Journal of the Taiwan Institute of Chemical Engineers
Topics
Physics
Materials Science
Chemistry
Engineering
Medicine
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DOI
10.1016/j.jtice.2024.105825