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Preparation and characterization of PA66 composites by wa... | ResearchHub
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Preparation and characterization of PA66 composites by waste printed circuit board non‐metallic fractions
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Authors
Yue Ning
5 more
Yue Ning
•
Yugang Li
3 more
•
Qing Huang
Published
December 2, 2024
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Journal
Polymer Composites
Topics
Engineering
Materials Science
Industrial And Manufacturing Engineering
Automotive Engineering
Mechanical Engineering
Show all topics
DOI
10.1002/pc.29331
