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Comparison of strength degradation for SnAgCu solders wit... | ResearchHub
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Comparison of strength degradation for SnAgCu solders with various Ag contents during thermal cycling
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Authors
Xiaojing Wang
8 more
Xiaojing Wang
•
Quan-Zhen Li
6 more
•
Salah El‐Bahy
Published
December 5, 2024
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Journal
Advanced Composites and Hybrid Materials
Topics
Computer Science
Materials Science
Physics
Electrical And Electronic Engineering
Aerospace Engineering
Show all topics
DOI
10.1007/s42114-024-01101-3
