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Investigation of the deposition mechanism of Cu seed laye... | ResearchHub
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Investigation of the deposition mechanism of Cu seed layer atoms on the Ta (001) surface from the atomic perspective
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Authors
Bo Zhao
6 more
Bo Zhao
•
Rui Li
4 more
•
Sheng Liu
Published
December 10, 2024
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Journal
Applied Surface Science
Topics
Computer Science
Materials Science
Physics
Chemistry
Artificial Intelligence
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DOI
10.1016/j.apsusc.2024.162037
