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Incorporating negative thermal expansion Cu2V2O7 into epo... | ResearchHub
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Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity
0
Authors
Jinguo Li
11 more
Jinguo Li
•
Feiyu Qin
9 more
•
Xiangdong Ding
Published
January 1, 2025
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Journal
Journal of Alloys and Compounds
Topics
Physics
Materials Science
Materials Chemistry
Electrical And Electronic Engineering
Composite Material
Show all topics
DOI
10.1016/j.jallcom.2025.178601
