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Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity
Materials Chemistry
Electrical And Electronic Engineering
Physics
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Authors
Jinguo Li
,
Feiyu Qin
Yuguang Lv
,
Xin Yang
,
Tianhang Wu
,
Xiao-Ling Wang
,
Wenhui Xu
,
Nianjie Liu
,
Jun Wang
,
Lei Hu
,
Jun Sun
+9 authors
,
Xiangdong Ding
Journal
Journal of Alloys and Compounds
Published
Jan 1, 2025
DOI
10.1016/j.jallcom.2025.178601
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