Laser & Photonics ReviewsVolume 18, Issue 12 2470074 Inside Back CoverFree Access Angle-Insensitive Spectral Imaging Based on Topology-Optimized Plasmonic Metasurfaces (Laser Photonics Rev. 18(12)/2024) Jiawei Yang, Jiawei YangSearch for more papers by this authorKaiyu Cui, Kaiyu CuiSearch for more papers by this authorYidong Huang, Yidong HuangSearch for more papers by this authorWei Zhang, Wei ZhangSearch for more papers by this authorXue Feng, Xue FengSearch for more papers by this authorFang Liu, Fang LiuSearch for more papers by this author Jiawei Yang, Jiawei YangSearch for more papers by this authorKaiyu Cui, Kaiyu CuiSearch for more papers by this authorYidong Huang, Yidong HuangSearch for more papers by this authorWei Zhang, Wei ZhangSearch for more papers by this authorXue Feng, Xue FengSearch for more papers by this authorFang Liu, Fang LiuSearch for more papers by this author First published: 09 December 2024 https://doi.org/10.1002/lpor.202470074AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookxLinkedInRedditWechat Graphical Abstract 3D Photonic Device for Spatial Mode Bases Mapping On-chip angle-robust computational spectral imaging based on topology-optimized plasmonic metasurfaces is proposed and experimentally reported in article number 2400255 by Kaiyu Cui, Yidong Huang, and co-workers. The fidelity of spectral reconstruction realized by an auto-encoder is over 98% under a 30° field-of-view, and spectral imaging for a standard color checker is demonstrated. This approach expands the application fields of spectral imaging chips such as wide-angle or off-axis spectral imaging. Volume18, Issue12December 20242470074 RelatedInformation